Semiconductor device manufacturing method

ABSTRACT

A transparent board is positioned on a support board provided with a positioning mark, and a release material is provided. A semiconductor element is then positioned so that the electrode element faces upward, and the support board is then removed. An insulating resin is then formed on the release material so as to cover the semiconductor element; and a via, a wiring layer, an insulation layer, an external terminal, and a solder resist are then formed. The transparent board is then peeled from the semiconductor device through the use of the release material. A chip can thereby be mounted with high precision, there is no need to provide a positioning mark during mounting of the chip on the substrate in the manufacturing process, and the substrate can easily be removed. As a result, a semiconductor device having high density and a thin profile can be manufactured at low cost.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a semiconductor device that houses asemiconductor element, and to a method for manufacturing thesemiconductor device.

2. Description of the Related Art

Size reduction, increased functionality, and increased performance ofelectronic devices have been in demand in recent years, and high-densitypackaging techniques for semiconductor packaging have therefore becomeessential. Wire bonding connection using metal wire or the like, andflip-chip connection using solder balls, have been used as conventionalmethods for connecting a wiring board with a semiconductor element, butthese methods all have such problems as are described below. Forexample, wire bonding connection has the merit of low cost, but becausethe wire diameter must be reduced in narrower pitches, wire breakage andconfined connection conditions occur. In flip-chip connection, higherspeed transmission is possible than in a wire bonding connection, but inthe case of narrow-pitch connections or a large number of terminals inthe semiconductor element, the connection strength of the solder bumpsis reduced, and there is therefore an increased occurrence of crackingin the connection locations, and connection defects are created byvoids.

Therefore, semiconductor devices in which a semiconductor element isbuilt into a board, i.e., semiconductor element embedding techniques,have been recently proposed as high-density packaging techniques thatmake it possible to achieve increased integration and functionality ofsemiconductor devices, and that have numerous merits such as reducedpackage profile, reduced cost, high-frequency response, and low-stressconnection by plating connections. Semiconductor devices that utilizethe semiconductor element embedding technique are disclosed in JapanesePatent Application Kokai Publication Nos. 2002-16173, 2001-250902, and2001-237362, for example.

However, in the conventional semiconductor element embedding technique,a semiconductor element (chip) is first mounted on one side, on bothsides, or in a concave part provided to a flat surface of a substratecomposed of resin or metal. Because of cost and other reasons, asubstrate composed of resin or metal and used in a board process must bea large sheet, but because of warping, swelling, and lack of flatness ina substrate composed of resin or metal, it becomes difficult to mountthe chip on the substrate with high precision. Since a positioning markfor mounting the chip must also be provided in advance on the substrate,the step for forming the positioning mark contributes to increased cost.

As shown in FIGS. 1 and 2, a conventional semiconductor device haspositioning marks 22 or depressions 27 based on such positioning marks.However, the positioning marks 22 and the depressions 27 based on suchpositioning marks act as non-flat portions of the surface of aninsulation resin 12 and are the origins of cracks, and therefore causereduced reliability of the semiconductor device. When the substrate ismetal, the metal must be etched to remove the substrate aftermanufacturing in order to reduce the thickness of the semiconductordevice. Consequently, costs are increased by the increased amount ofprocessing.

SUMMARY OF THE INVENTION

An object of the present invention is to provide a semiconductor devicein which a chip can be mounted with high precision, there is no need toprovide a positioning mark for positioning the chip on a substrate, thesubstrate can easily be removed in the manufacturing process, and highdensity and a thin profile can be achieved at low cost; and to provide amethod for manufacturing the semiconductor device.

The semiconductor device according to the present invention comprises asemiconductor element having an electrode terminal; an insulation layerformed so as to seal a side surface and a surface provided with theelectrode terminal of the semiconductor element; and one or more wiringlayers electrically connected to the electrode terminal; wherein asurface opposite from the surface on the side provided with the wiringlayer in the insulation layer is a flat surface that is parallel to asurface on a side that is opposite from the surface provided with theelectrode terminal of the semiconductor element.

In this case, the surface on a side that is opposite from the surfaceprovided with the electrode terminal of the semiconductor element may bein the same plane as the flat surface of the insulation layer. Thesurface on a side that is opposite from the surface provided with theelectrode terminal of the semiconductor element may also protrude or berecessed in relation to the flat surface.

A cured adhesion layer may be formed on the surface on a side that isopposite from the surface provided with the electrode terminal of thesemiconductor element, or a cured adhesion layer may be formed on theflat surface of the insulation layer. Furthermore, a cured adhesionlayer may be formed on the surface on a side that is opposite from thesurface provided with the electrode terminal of the semiconductorelement, and on the flat surface of the insulation layer.

Furthermore, a transparent board may be provided to the side that isopposite from the surface provided with the electrode terminal of thesemiconductor element. In this case, the transparent board may beconfigured to be a glass board, or a metal via that passes through thetransparent board may be provided to the transparent board.

Furthermore, a heat sink may be provided to the side that is oppositefrom the surface provided with the electrode terminal of thesemiconductor element.

The method for manufacturing a semiconductor device according to thepresent invention comprises the steps of positioning a transparent boardflat-side-up on a support board provided with a positioning mark formounting a semiconductor element; mounting the semiconductor element onthe transparent board using the positioning mark on the support board asa reference so that a surface provided with an electrode terminal facesupward; removing the support board after the semiconductor element ismounted; forming an insulation layer on the transparent board so as toseal a side surface and the surface provided with the electrode terminalof the semiconductor element; forming one or more wiring layerselectrically connected to the electrode terminal of the semiconductorelement; and peeling off the transparent board.

The method for manufacturing a semiconductor device according to anotheraspect of the present invention comprises the steps of positioning atransparent board flat-side-up on a support board provided with apositioning mark for mounting a semiconductor element; mounting thesemiconductor element on the transparent board using the positioningmark on the support board as a reference so that a surface provided withan electrode terminal faces upward; removing the support board after thesemiconductor element is mounted; forming an insulation layer on thetransparent board so as to seal a side surface and the surface providedwith the electrode terminal of the semiconductor element; and formingone or more wiring layers electrically connected to the electrodeterminal of the semiconductor element.

In this case, the transparent board may be a glass board, or a via maybe provided so as to pass through the transparent board in the step ofpositioning the transparent board.

A release material may be provided on the transparent board in the stepof positioning the transparent board, and the release material may be aphoto-curable material.

Furthermore, the semiconductor element may be mounted via an adhesionlayer in the step of mounting the semiconductor element.

Furthermore, a heat sink may be mounted on a side that is opposite fromthe surface provided with the electrode terminal of the semiconductorelement.

The present invention makes it possible to obtain a high-density,thin-profile, low-cost semiconductor device and a method formanufacturing the same whereby a chip can be mounted with high precisionand whereby a substrate can easily be removed without the need toprovide a positioning mark during mounting of the chip on the substratein the manufacturing process.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a sectional view showing the first conventional semiconductordevice;

FIG. 2 is a sectional view showing the second conventional semiconductordevice;

FIG. 3 is a sectional view showing the semiconductor device according toa first embodiment of the present invention;

FIG. 4 is a sectional view showing a first modification of thesemiconductor device according to the first embodiment;

FIG. 5 is a sectional view showing a second modification of thesemiconductor device according to the first embodiment;

FIG. 6 is a sectional view showing the semiconductor device according toa second embodiment of the present invention;

FIG. 7 is a sectional view showing a modification of the semiconductordevice according to the second embodiment;

FIG. 8 is a sectional view showing the semiconductor device according toa third embodiment of the present invention;

FIG. 9 is a sectional view showing a modification of the semiconductordevice according to the third embodiment;

FIG. 10 is a sectional view showing the semiconductor device accordingto a fourth embodiment of the present invention;

FIGS. 11A through 11G are sectional views showing the sequence of stepsin the method for manufacturing a semiconductor device according to afifth embodiment of the present invention;

FIGS. 12A and 12B are a sectional view and a top view, respectively,showing the positioning marks when the semiconductor element is mounted;

FIGS. 13A through 13G are sectional views showing the sequence of stepsin the method for manufacturing a semiconductor device according to asixth embodiment of the present invention; and

FIGS. 14A through 14F are sectional views showing the sequence of stepsin the method for manufacturing a semiconductor device according to aseventh embodiment of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

In the present invention, an insulation layer seals a side surface and asurface provided with an electrode terminal of the semiconductorelement, and a flat surface is provided to the surface on a side that isopposite from the surface provided with the electrode terminal. The flatsurface is created by placing a semiconductor element in a so-calledface-up state on a transparent board made of glass, for example, andthen forming an insulation layer so as to seal the side surface and thesurface provided with the electrode terminal of the semiconductorelement. Since warping, swelling, surface irregularity, and the like areextremely minimal in a glass board, a semiconductor element having anincreased degree of integration can be mounted in the desired positionwith high precision even when the transparent board is a large sheet.Since the flat surface formed on the insulation layer also has extremelyminimal warping and the like, a heat sink or other component can also bemounted with high precision on this surface.

In the present invention, a transparent board as a substrate ispositioned on a support board provided with a positioning mark formounting the semiconductor element, and the semiconductor element, theinsulation layer, and other components are positioned or formed on thetransparent board. Since the positioning marks on the support board arerecognized through the transparent board during positioning of thesemiconductor element, the positioning marks and depressions/protrusionsbased on such positioning marks are not allowed to remain in thesemiconductor device, particularly in the insulation layer. Cracking,which tends to occur in these portions in the conventional technique, isthereby prevented, and the reliability of the semiconductor device canbe enhanced. In the present invention, the phrase “flat surface of theinsulation layer” is assumed to mean that the abovementioned positioningmarks and warping caused by the positioning mark do not remain on thesurface of the insulation layer.

The profile size of the semiconductor device can be reduced by removingthe transparent board from the semiconductor device during the processof manufacturing, but the transparent board may also be integrated withthe semiconductor device. A step for forming a positioning mark for eachsemiconductor device can also be eliminated by reusing the support boardafter the support board is removed during manufacturing.

Furthermore, the transparent board can easily be peeled from thesemiconductor device by providing a release material between thetransparent board and the semiconductor element and insulation layer.Particularly through the use of a photo-curable release material, thetransparency of the glass can be utilized to radiate light from thelower surface of the transparent board for easy separation. Providing anadhesion layer also makes it possible to retain the semiconductor devicein a prescribed position and to form wiring layers and the like withhigh precision. The release material and the adhesion layer may also bejointly used.

Embodiments of the present invention will be described in detailhereinafter with reference to the accompanying drawings. A firstembodiment of the present invention will first be described. FIG. 3 is asectional view showing the semiconductor device according to the firstembodiment. The abovementioned insulation layer is equivalent to theinsulation resin 12 in the description of the embodiments givenhereinafter.

As shown in FIG. 3, the semiconductor device 26 of the presentembodiment is provided with a semiconductor element 11 having anelectrode terminal 13 on a first surface thereof. An insulation resin 12is formed so as to seal the side surface and the surface provided withthe electrode terminal 13 of the semiconductor element 11. A via 14, aninsulation layer 16, and a wiring layer 15 for electrically connectingthe electrode terminal 13 to an external terminal 17 of thesemiconductor device 26 are provided to the upper surface of theelectrode terminal 13. A solder resist 18 is provided on the surface ofthe insulation layer 16 so as to expose a portion of the externalterminal 17 and to cover the remaining portion thereof. In thesemiconductor element 11, the surface on a side that is opposite fromthe surface to which the electrode terminal 13 is provided is exposedfrom the insulation resin 12, and the insulation layer 12 is notprovided with positioning marks and depressions/protrusions based onsuch positioning marks for positioning the semiconductor element 11. Thelower surface of the insulation resin 12 is parallel to the back surfaceof the semiconductor element 11, and is in the same plane as the backsurface of the semiconductor element 11 in the present embodiment. Thelower surface of the insulation resin 12 also has a high degree offlatness. Although not shown in the drawings, a heat sink or othercomponent may be mounted on the same flat surface described above. Withregard to the semiconductor element 11 in the present specification, thesurface on a side that is opposite from the surface to which theelectrode terminal 13 is provided is referred to as the back surface ofthe semiconductor element 11. In the insulation resin 12, the surface onthe back side of the semiconductor element 11 is referred to as thelower surface of the insulation resin 12.

The insulation resin 12 is formed from a photosensitive ornon-photosensitive organic material, for example. Examples of organicmaterials that can be used include epoxy resin, epoxy acrylate resin,urethane acrylate resin, polyester resin, phenol resin, polyimide resin,BCB (benzocyclobutene), PBO (polybenzoxazole), polynorbornene resin, andthe like, as well as glass cloth or a woven or nonwoven cloth formed byaramid fibers or the like that is impregnated with epoxy resin, epoxyacrylate resin, urethane acrylate resin, polyester resin, phenol resin,polyimide resin, BCB, PBO, polynorbornene resin, or the like.

The primary component of the wiring layer 15 is one or more types ofmetal selected from the group consisting of copper, silver, gold,nickel, aluminum, and palladium. Copper is most preferred from theperspectives of electrical resistance and cost.

The insulation layer 16 is formed from a photosensitive ornon-photosensitive organic material, for example. Examples of organicmaterials that can be used include epoxy resin, epoxy acrylate resin,urethane acrylate resin, polyester resin, phenol resin, polyimide resin,BCB, PBO, polynorbornene resin, and the like, as well as glass cloth ora woven or nonwoven cloth formed by aramid fibers or the like that isimpregnated with epoxy resin, epoxy acrylate resin, urethane acrylateresin, polyester resin, phenol resin, polyimide resin, BCB, PBO,polynorbornene resin, or the like. The insulation layer 16 may also beformed using the same material as the insulation resin 12.

In the embodiment shown in FIG. 3, the wiring layer 15 comprises twolayers, and the insulation layer 16 comprises three layers, but thisconfiguration is not limiting, and the wiring layer 15 and theinsulation layer 16 may be composed of the necessary number of layers.The wiring layer 15 is formed in the region of the insulation layer 16in FIG. 3, but a configuration may be adopted in which the first layerof the wiring layer 15 as viewed from the semiconductor element 11 isformed in the region of the insulation resin 12.

The same material as the wiring layer 15 may be selected and used as theexternal terminal 17, and one or more types of metal selected from thegroup consisting of gold, silver, copper, tin, and solder material maybe formed on the surface of the external terminal 17. A photosensitiveresist ink, for example, may be used as the solder resist 18.

In the present embodiment, a configuration is adopted in which the lowersurface of the insulation resin 12 is a highly flat surface. The reasonfor this is that the semiconductor element 11 is placed on a transparentglass plate having a flat surface, and the insulation resin 12 is thenformed thereon as described hereinafter in the description of themanufacturing method. A glass plate has extremely minimal warping,swelling, surface irregularities, and the like in comparison to resin,metal, or the like. A glass plate is also used as the substrate in thesemiconductor element 11. The semiconductor element 11 can therefore bemounted in the intended position on the glass plate with high precision.Since the back surface of the semiconductor element 11 and the lowersurface of the insulation resin 12 are in the same plane, and the lowersurface of the insulation resin 12 is a highly flat surface, a heat sinkor other component can also be stably mounted with high precision on theback surface of the semiconductor element 11.

In the present embodiment, the semiconductor device 26, and particularlythe insulation resin 12, is free of positioning marks anddepressions/protrusions based on such positioning marks for mounting thesemiconductor element 11. This is because the positioning marks areprovided to a support board that is not included in the semiconductordevice 26, as described hereinafter in the description of themanufacturing method. Specifically, when the semiconductor element 11 ispositioned, the positioning marks are visible through the glass platepositioned between the semiconductor device 26 and the support board. Asmentioned above, since the glass plate has a high degree of flatness,the semiconductor element 11 can be properly positioned withoutproviding positioning marks to the insulation resin 12 and othercomponents. Since the semiconductor device 26 is thus free ofpositioning marks and depressions/protrusions based on such positioningmarks, cracks that easily formed in these portions in the conventionaltechnique can be prevented, and the reliability of the semiconductordevice 26 can be enhanced.

The semiconductor device of the present embodiment described above is asingle-sided terminal semiconductor device in which the externalterminal 17 is provided to one side of the semiconductor device 26, butthe present invention is not limited to this configuration. For example,a double-sided terminal semiconductor device may be created by providinga via that exposes the back surface of the semiconductor element 11.

In the semiconductor device of the present embodiment described above,the back surface of the semiconductor element 11 is in the same plane asthe lower surface of the insulation resin 12, but the present inventionis not limited to this configuration. For example, as shown in FIG. 2,the back surface of the semiconductor element 11 may protrude inrelation to the lower surface of the insulation resin 12. Through such aconfiguration, the semiconductor element 11 has a greater exposedsurface area, and heat dissipation characteristics can therefore beenhanced. The thickness of the semiconductor element 11 can also beadjusted by processing the protruding part of the semiconductor element11.

Furthermore, as shown in FIG. 5, a configuration may be adopted in whichthe back surface of the semiconductor element 11 is recessed in relationto the lower surface of the insulation resin 12. Through such aconfiguration, the end parts of the semiconductor element 11 can beprevented from peeling and chipping.

Furthermore, a condenser for acting as a circuit noise filter may beprovided in a prescribed position of the wiring assembly composed of thevia 14, the wiring layer 15, and the insulation layer 16. Preferredinductor materials for forming the condenser include titanium oxide,tantalum oxide, Al₂O₃, SiO₂, ZrO₂, HfO₂, Nb₂O₅, and other metal oxides;BST (Ba_(x)Sr_(1-x)TiO₃), PZT (PbZr_(x)Ti_(1-x)O₃), PLZT(Pb_(1-y)La_(y)Zr_(x)Ti_(1-x)O₃), and other perovskite-based materials;and SrBi₂Ta₂O₉ and other Bi-based laminar compounds. In the formulaeabove, the relationships 0≦x≦1 and 0≦y≦1 are satisfied. Inorganicmaterials, organic materials mixed with a magnetic material, and thelike may be used as the inductor material for forming the condenser.Resistors and other discrete components may be furthermore provided inaddition to the semiconductor element and the condenser.

Furthermore, a stiffener, a heat spreader, or the like may be mounted onthe back surface of the semiconductor element 11.

A second embodiment of the present invention will next be described.FIG. 6 is a sectional view showing the semiconductor device according tothe second embodiment.

Since items other than those described below in FIG. 6 are the same asin the first embodiment, the same reference symbols are used in FIG. 6to refer to components that are the same as in FIG. 3, and no detaileddescription thereof will be given.

As shown in FIG. 6, the back surface of the semiconductor element 11 isrecessed in relation to the lower surface of the insulation resin 12 inthe semiconductor device 26 of the present embodiment. A cured adhesivematerial 19 is provided in the depression, and the exposed surface ofthe adhesive material 19 is in the same plane as the lower surface ofthe adjacent insulation resin 12. Aspects of the configuration otherthan those described above are the same as in the first embodiment shownin FIG. 3, and there are also no positioning marks anddepressions/protrusions based on such positioning marks provided to theinsulation resin 12 in order to mount the semiconductor element 11.

The adhesive material 19 is a photosensitive or non-photosensitiveorganic material, for example. Examples of materials that can be used asthe adhesive material 19 include epoxy resin, epoxy acrylate resin,urethane acrylate resin, polyester resin, phenol resin, polyimide resin,BCB, PBO, polynorbornene resin, and the like.

In the present embodiment, the cured adhesive material 19 is provided inthe depression formed by the insulation resin 12 and the back surface ofthe semiconductor element 11. The cured adhesive material 19 is providedin order to increase adhesion when the semiconductor element 11 ispositioned on the substrate and the release material in themanufacturing method (FIG. 13) described hereinafter. By positioning thesemiconductor element 11 via the adhesive material 19 in this manner,the semiconductor element 11 can be prevented from becoming misaligneddue to thermal history, stress, and the like in the step for forming thewiring assembly.

In the semiconductor device of the present embodiment shown in FIG. 6,the adhesive material 19 is provided to the back surface of thesemiconductor element 11. This corresponds to providing the adhesivematerial 19 to the semiconductor device shown in FIG. 5, and theadhesive material 19 may also be provided to the lower surface of theinsulation resin 12. As shown in FIG. 7, the adhesive material 19 may beprovided to both the back surface of the semiconductor element 11 andthe lower surface of the adjacent insulation resin 12. The back side ofthe semiconductor element 11 is thereby composed of the same material inthe same plane, and a heat sink or various types of components can bestably mounted to this surface.

A third embodiment of the present invention will next be described. FIG.8 is a sectional view showing the semiconductor device according to thethird embodiment. Since items other than those described below in FIG. 8are the same as in the first embodiment, the same reference symbols areused in FIG. 8 to refer to components that are the same as in FIG. 3,and no detailed description thereof will be given.

As shown in FIG. 8, the semiconductor device 26 of the presentembodiment is provided with a transparent board 23 that is in contactwith the back surface of the semiconductor element 11 and the adjacentlower surface of the insulation resin 12. Non-alkali glass, metallicglass, soda-lime glass, acrylic class, crystal glass, quartz glass,glass fibers, liquid glass, a glass ceramic, or the like, for example,may be used as the transparent board 23. Aspects of the configurationother than those described above are the same as in the first embodimentshown in FIG. 3, and there are also no positioning marks anddepressions/protrusions based on such positioning marks provided to theinsulation resin 12 in order to mount the semiconductor element 11.

In the present embodiment, providing the transparent board 23 to thesemiconductor device 26 enhances the rigidity of the semiconductordevice 26. As a result, a semiconductor device 26 that is free ofwarping or swelling can be provided. Specifically, since the mechanicalstrength of the semiconductor device 26 increases, the semiconductordevice 26 has minimal deformation when hot, and the secondary packagingreliability when the semiconductor device is packaged in a device isenhanced. Since the transparent board 23 has excellent flatness, heatsinks or various other types of components can be mounted on the lowersurface thereof with high precision.

In the present embodiment shown in FIG. 8, the transparent board 23 isprovided to the back surface of the semiconductor element 11 of thesemiconductor device 26 shown in FIG. 3, but the present invention isnot limited to this configuration. For example, the transparent board 23may be provided to the back surface of the semiconductor element 11 ofthe semiconductor device 26 shown in any of FIGS. 4 through 7 referencedin the description of the first and second embodiments.

In the semiconductor device of the present embodiment shown in FIG. 8, ametal via 25 having a through-hole is not provided to the transparentboard 23, but a metal via 25 may be provided as shown in FIG. 9. Heatgenerated from the semiconductor element 11 can thereby be efficientlydissipated from the transparent board 23.

A fourth embodiment of the present invention will next be described.FIG. 10 is a sectional view showing the semiconductor device accordingto the fourth embodiment. Since items other than those described belowin FIG. 10 are the same as in the first embodiment, the same referencesymbols are used in FIG. 8 to refer to components that are the same asin FIG. 3, and no detailed description thereof will be given.

As shown in FIG. 10, the semiconductor device 26 of the presentembodiment is provided with a heat sink 20 that is in contact with theback surface of the semiconductor element 11, and the lower surface ofthe adjacent insulation resin 12. Aspects of the configuration otherthan those described above are the same as in the first embodiment shownin FIG. 3, and there are also no positioning marks anddepressions/protrusions based on such positioning marks provided to theinsulation resin 12 in order to mount the semiconductor element 11.

In the present embodiment, the heat dissipation properties of thesemiconductor device 26 can be enhanced by providing the heat sink 20 tothe semiconductor device 26.

In the present embodiment shown in FIG. 10, the heat sink 20 is providedto the back surface of the semiconductor element 11 of the semiconductordevice 26, but the present invention is not limited to thisconfiguration. For example, the transparent board 23 may be provided tothe back surface of the semiconductor element 11 of the semiconductordevice 26 shown in any of FIGS. 4 through 9 referenced in thedescription of Embodiments 1 through 3. The heat sink 20 shown in FIG.10 is merely an example, and a stiffener, a heat spreader, or anothercomponent, for example, may also be provided to the surface on which theheat sink 20 is mounted.

A fifth embodiment of the present invention will next be described. Thepresent embodiment is an embodiment of the method for manufacturing thesemiconductor device according to the first embodiment shown in FIG. 3.FIGS. 11A through 11G are sectional views showing the sequence of stepsof the method for manufacturing a semiconductor device according to thefifth embodiment. FIGS. 12A and 12B are a sectional view and a top view,respectively, showing the positioning marks during mounting of thesemiconductor element.

A support board 21 is first prepared on which positioning marks 22 areprovided, as shown in FIG. 11A. Resin, metal, glass, or a combination ofany thereof may be used as the material of the support board 21. Thepositioning marks 22 can be recognized with high precision, and may beprovided by various methods so as to function as positioning marks 22.For example, it is possible to use a method in which metal is depositedon the support board 21, or a method in which a depression is providedby wet etching or machining. In the present embodiment, the supportboard 21 is composed of stainless steel having a thickness of 5 mm, andthe positioning marks 22 are formed by nickel having a thickness of 5 μmthat is formed by electroplating on the support board 21.

The transparent board 23 is then mounted flat-side-up on the supportboard 21 provided with the positioning marks 22, as shown in FIG. 11B.Non-alkali glass, metallic glass, soda-lime glass, acrylic class,crystal glass, quartz glass, glass fibers, liquid glass, a glassceramic, or the like, for example, may be used as the transparent board23. Even if the transparent board 23 is not visibly transparent, it issufficient insofar as the positioning marks 22 on the support board 21can be recognized by radiating solar light, laser light, synchrotronradiation, infrared rays, ultraviolet rays, X rays, or other light.Non-alkali glass is used in the present embodiment. A release material24 is then provided on the transparent board 23. Adhesion properties areincluded in the functions of the release material 24, but the releasematerial 24 is preferably cured by irradiation by ultraviolet rays orthe like to become a low-adhesive material. Ultraviolet-curable film isused in the present embodiment.

The semiconductor element 11 is then mounted on the transparent board 23via the release material 24 in a so-called face-up state in which thesurface to which the electrode terminal 13 is provided faces upward(opposite side from that of the transparent board 23), as shown in FIG.11C. At this time, the transparency of the transparent board 23 isutilized to mount the semiconductor element 11 using the positioningmarks 22 of the support board 21 as a reference, as shown in FIG. 12.FIGS. 12A and 12B correspond to FIG. 11C, but the length of one side ofthe transparent board 23 and the release material 24 is made differentfor the sake of convenience.

Since the non-alkali glass used as the transparent board 23 hasextremely minimal warping and swelling in relation to resin and metaleven when the size thereof is 1 m×1 m, for example, the semiconductorelement 11 can be mounted with high precision. In FIGS. 11 and 12, asingle semiconductor element 11 is shown to simplify the description,but a plurality of semiconductor elements 11 may also be mounted. Therelease material 24 is also preferably transparent and thin in order tofacilitate recognition of the positioning marks 22, but holes may alsobe formed in the portions of the release material 24 that correspond tothe positioning marks 22, for example.

The support board 21 is then removed from the transparent board 23 onwhich the semiconductor element 11 is mounted, as shown in FIG. 11D. Thesupport board 21 thus removed may be reused.

The insulation resin 12 is then layered so that the side surfaces andsurface in which the electrode terminal 13 of the semiconductor element11 is provided are covered, as shown in FIG. 11E. The insulation resin12 is formed from a photosensitive or non-photosensitive organicmaterial, for example. Examples of organic materials that can be usedinclude epoxy resin, epoxy acrylate resin, urethane acrylate resin,polyester resin, phenol resin, polyimide resin, BCB, PBO, polynorborneneresin, and the like, as well as glass cloth or a woven or nonwoven clothformed by aramid fibers or the like that is impregnated with epoxyresin, epoxy acrylate resin, urethane acrylate resin, polyester resin,phenol resin, polyimide resin, BCB, PBO, polynorbornene resin, or thelike. Examples of the layering method used include transfer molding,compression form molding, printing, vacuum pressing, vacuum lamination,spin coating, die coating, curtain coating, and the like. An epoxy resinis formed using vacuum lamination in the present embodiment. When theinsulation resin 12 is formed, a hole may be provided to the organicmaterial in advance in a location that corresponds to the semiconductorelement 11.

The via 14, the wiring layer 15, and the insulation layer 16 are thenformed to electrically connect the external terminal 17 and theelectrode terminal 13 on the semiconductor element 11, as shown in FIG.11F. To form the via 14, an opening is first provided in the insulationresin 12 in a position that corresponds to the via 14. When aphotosensitive material is used as the insulation resin 12, the openingis formed by photolithography. When the insulation resin 12 is anon-photosensitive material or a photosensitive material having a lowpattern resolution, the opening is formed by laser processing, dryetching, or a blasting method. The opening is formed using laserprocessing in the present embodiment. One or a plurality of types ofmetal whose primary component is selected from the group consisting ofcopper, silver, gold, nickel, aluminum, and palladium is then filledinto the opening, and the via 14 is formed. The opening is filled byelectroplating, electroless plating, printing, molten metal suction, oranother method. The via 14 may also be formed by a process in which theinsulation layer 16 is formed after a post for electrical conduction isformed in advance in the position of the via 14, and the surface of theinsulation layer 16 is ground down by polishing to expose the conductionpost. This method obviates the need for forming an opening in theinsulation layer 16.

The wiring layer 15 is formed by a subtractive method, a semi-additivemethod, a full additive method, or other method. The subtractive methodis a method whereby a resist is formed in the desired pattern on acopper foil provided on a board, and the unnecessary copper foil isetched, after which the resist is peeled off to obtain the desiredpattern. The semi-additive method is a method whereby a power supplylayer is formed by electroless plating, sputtering, CVD (Chemical VaporDeposition), or another method, after which a resist having the desiredpattern in the open portion thereof is formed, metal is deposited byelectroplating into the open portion of the resist, and the resist isremoved, and the power supply layer is then etched to obtain the desiredwiring pattern. The full additive method is a method whereby anelectroless plating catalyst is deposited on a board, after which apattern is formed in the resist, the catalyst is activated while theresist remains as an insulation film, and the desired wiring pattern isobtained by depositing metal in the open portion of the insulation filmby electroless plating. The primary component of the wiring layer 15 isone or more types of metal selected from the group consisting of copper,silver, gold, nickel, aluminum, and palladium. Copper is particularlypreferred from the perspectives of electrical resistance and cost. Thewiring layer 15 is formed by copper using the semi-additive method inthe present embodiment.

The insulation layer 16 is formed from a photosensitive ornon-photosensitive organic material, for example. Examples of organicmaterials that can be used include epoxy resin, epoxy acrylate resin,urethane acrylate resin, polyester resin, phenol resin, polyimide resin,BCB, PBO, polynorbornene resin, and the like, as well as glass cloth ora woven or nonwoven cloth formed by aramid fibers or the like that isimpregnated with epoxy resin, epoxy acrylate resin, urethane acrylateresin, polyester resin, phenol resin, polyimide resin, BCB, PBO,polynorbornene resin, or the like. Epoxy resin is used in the presentembodiment.

The insulation layer 16 may be layered using the same method as theabovementioned method for layering the insulation resin 12. An examplein which there are two layers of conductors and three layers ofinsulation is shown in FIG. 11, but the steps for forming the via 14,the wiring layer 15, and the insulation layer 16 may be repeatedaccording to the desired number of layers.

The pattern of the solder resist 18 is then formed on the uppermostwiring layer 15. The solder resist 18 is formed to provide flameretardant properties and surface circuit protection to the semiconductordevice 26. The material of the solder resist 18 is composed of anepoxy-based, acrylic-based, urethane-based, or polyimide-based organicmaterial, and an inorganic or organic filler may also be added asneeded. A photosensitive resist ink, for example, may be used as thesolder resist 18. A photosensitive resist ink is used in the presentembodiment. The external terminal 17 is then formed on the surfaceexposed from the solder resist 18. The same material as the wiring layer15 may be selected and used as the external terminal 17, and one or moretypes of metal selected from the group consisting of gold, silver,copper, tin, and solder material may be formed on the surface of theexternal terminal 17. In the present embodiment, a nickel layer having athickness of 3 μm and a gold layer having a thickness of 0.5 μm arelayered in sequence on the surface of the external terminal 17. Thesolder resist 18 is used in the present embodiment, but a configurationmay also be adopted for the semiconductor device 26 in which the solderresist 18 is not used.

The transparent board 23 is then peeled from the semiconductor device26, as shown in FIG. 11G. Ultraviolet rays are radiated to the releasematerial 24 from the lower surface of the transparent board 23 at thistime. As described above, since the ultraviolet-curable release material24 is used in the present embodiment, the adhesion of the releasematerial 24 can be reduced by ultraviolet radiation, and the transparentboard 23 can easily be peeled from the semiconductor device 26. Thesemiconductor device 26 of the present embodiment is obtained by theprocess described above. The insulation resin 12 and the back surface ofthe semiconductor element 11 are in the same plane in FIG. 11G, but aconfiguration may also be adopted in which the back surface of thesemiconductor element 11 protrudes or is recessed in relation to theinsulation resin 12. In this case, one or both of the semiconductorelement 11 and insulation resin 12 may be removed by dry etching, wetetching, machining, or another method, and material may be layered usingelectroplating, CVD, or another method.

In the manufacturing method of the present embodiment, the positioningmarks 22 are provided on the support board 21, the transparent board 23is positioned thereon, and the semiconductor device 26 is formed on thetransparent board 23. The positioning marks 22 provided to the supportboard 21 are utilized through the use of a transparent board 23 havingexcellent transparency, and there is therefore no need for a step toform the positioning marks 22 on the semiconductor device 26. Since thesupport board 21 can be reused, the number of steps needed to form thepositioning marks can be reduced. Since the glass plate used as thetransparent board 23 has extremely minimal warping, swelling, andsurface irregularities, the semiconductor element 11 can be mounted withhigh precision even when the glass plate is large. Furthermore,providing the release material 24 to the upper surface of thetransparent board 23 makes it possible to easily peel the transparentboard 23 from the semiconductor device 26 in the above-described manner.As described above, the manufacturing method of the present embodimentmakes it possible to fabricate a low-cost semiconductor device whilemounting the semiconductor element with high precision.

A sixth embodiment of the present invention will next be described. Thepresent embodiment is an embodiment of the method for manufacturing thesemiconductor device according to the second embodiment shown in FIG. 6.FIGS. 13A through 13G are sectional views showing the sequence of stepsof the method for manufacturing a semiconductor device according to thesixth embodiment.

The transparent board 23 is first mounted on the support board 21 towhich the positioning marks 22 are provided, and the release material 24is formed thereon, as shown in FIGS. 13A and 13B. The abovementionedstep is the same as in the method for manufacturing a semiconductordevice according to the fifth embodiment. No detailed description willbe given below for steps in the manufacturing method that are the sameas those of the fifth embodiment.

The adhesive material 19 is then formed on the release material 24, asshown in FIG. 13C. The adhesive material 19 is a photosensitive ornon-photosensitive organic material, for example. Examples of materialsthat can be used as the adhesive material 19 include epoxy resin, epoxyacrylate resin, urethane acrylate resin, polyester resin, phenol resin,polyimide resin, BCB, PBO, polynorbornene resin, and the like. Epoxyresin is used in the present embodiment. The semiconductor element 11 isthen mounted on the adhesive material 19. At this time, thesemiconductor element 11 is mounted on the transparent board 23 in aso-called face-up state so that the surface of the semiconductor element11 to which the electrode terminal 13 is provided faces upward, the sameas in the fifth embodiment.

The insulation resin 12, the via 14, the wiring layer 15, the insulationlayer 16, the external terminal 17, and the solder resist 18 are thenformed as shown in FIGS. 13E through 13G. The transparent board 23 isthen peeled from the semiconductor device 26. The abovementioned stepsare the same as in the fifth embodiment. The semiconductor device 26 ofthe present embodiment is obtained by the process described above.

In the manufacturing method of the present embodiment, the semiconductorelement 11 is mounted on the release material 24 via the adhesivematerial 19. As described above, the release material 24 preferablyretains adhesive properties until the peeling step, but the presence ofthe adhesive material 19 further increases the adhesion of thesemiconductor element 11. The semiconductor element 11 can thereby beeffectively prevented from becoming misaligned due to thermal history,stress, and other effects in the steps for forming the wiring assembly.As described above, the manufacturing method of the present embodimentmakes it possible to maintain high precision in the mounting of thesemiconductor element 11.

A seventh embodiment of the present invention will next be described.The present embodiment is an embodiment of the method for manufacturingthe semiconductor device according to the third embodiment shown in FIG.8. FIGS. 14A through 14F are sectional views showing the sequence ofsteps in the method for manufacturing a semiconductor device accordingto the seventh embodiment.

A support board 21 is first prepared in which positioning marks 22 areprovided, as shown in FIG. 14A.

The transparent board 23 is then mounted on the support board 21 towhich the positioning marks 22 are provided, as shown in FIG. 14B.Non-alkali glass, metallic glass, soda-lime glass, acrylic class,crystal glass, quartz glass, glass fibers, liquid glass, a glassceramic, or the like, for example, may be used as the transparent board23. Even if the transparent board 23 is not visibly transparent, it issufficient insofar as the positioning marks 22 on the support board 21can be recognized by radiating solar light, laser light, synchrotronradiation, infrared rays, ultraviolet rays, X rays, or other light.Non-alkali glass is used in the present embodiment. A penetrating via 25such as the one shown in FIG. 7 may also be provided to the transparentboard 23. The heat of the semiconductor element 11 can thereby beefficiently dissipated from the transparent board 23.

The semiconductor element 11 is then mounted on the transparent board 23in a so-called face-up state so that the surface of the semiconductorelement 11 to which the electrode terminal 13 is provided faces upward,as shown in FIG. 14C. In this instance, the transparency of thetransparent board 23 is utilized to mount the semiconductor element 11using the positioning marks 22 of the support board 21 as a reference,the same as in the fifth embodiment.

The support board 21 is then removed from the transparent board 23 onwhich the semiconductor element 11 is mounted, as shown in FIG. 14D. Theinsulation resin 12, the via 14, the wiring layer 15, the insulationlayer 16, the external terminal 17, and the solder resist 18 are thenformed as shown in FIGS. 14E through 14F. The steps mentioned above arethe same as in the fifth embodiment. In the manufacturing method of thepresent embodiment, the transparent board 23 is not removed from thesemiconductor element 11 and the insulation resin 12. The semiconductordevice 26 of the present embodiment is thus obtained by integrating thetransparent board 23 with the semiconductor element 11 and theinsulation resin 12.

In the manufacturing method of the present embodiment, the semiconductordevice 26 is fabricated by integrating the transparent board 23 with thesemiconductor element 11 and the insulation resin 12. A semiconductordevice 26 that has minimal warping and swelling can thereby befabricated, and reliability can be enhanced. As described in the fifthembodiment above, the present embodiment has the same effects in thatthere is no need for a step for forming the positioning marks for thesemiconductor device 26 in the manufacturing process, and thesemiconductor element 11 can be mounted with high precision.

What is claimed is:
 1. A method for manufacturing a semiconductordevice, comprising the steps of: positioning a transparent boardflat-side-up on a support board provided with a positioning mark formounting a semiconductor element; mounting said semiconductor element onsaid transparent board using said positioning mark on said support boardas a reference so that a surface provided with an electrode terminalfaces upward; removing said support board with said positioning markafter said semiconductor element is mounted; forming an insulation layeron said transparent board so as to seal a side surface and the surfaceprovided with said electrode terminal of said semiconductor element;forming one or more wiring layers electrically connected to saidelectrode terminal of said semiconductor element; and peeling off saidtransparent board.
 2. A method for manufacturing a semiconductor device,comprising the steps of: providing a support board that has a surfacewith a positioning mark; positioning a transparent board that includes afirst main surface and a second main surface opposite said first mainsurface, said second main surface facing said surface of said supportboard; mounting a semiconductor element on said first main surface ofsaid transparent board using said positioning mark on said supportboard, seen through said transparent board, as a reference so that asurface provided with an electrode terminal faces upward; removing saidsupport board with said positioning mark after said semiconductorelement is mounted; forming an insulation layer on said transparentboard so as to seal a side surface and the surface provided with saidelectrode terminal of said semiconductor element; and forming one ormore wiring layers electrically connected to said electrode terminal ofsaid semiconductor element.
 3. The semiconductor device manufacturingmethod according to claim 1, wherein said transparent board is a glassboard.
 4. The semiconductor device manufacturing method according toclaim 2, wherein said transparent board is a glass board.
 5. Thesemiconductor device manufacturing method according to claim 2, furthercomprising providing a metal via that passes through said transparentboard.
 6. The semiconductor device manufacturing method according toclaim 1, further comprising providing a release material on saidtransparent board.
 7. The semiconductor device manufacturing methodaccording to claim 2, further comprising providing a release material onsaid transparent board.
 8. The semiconductor device manufacturing methodaccording to claim 6, wherein said release material is a photo-curablematerial.
 9. The semiconductor device manufacturing method according toclaim 7, wherein said release material is a photo-curable material. 10.The semiconductor device manufacturing method according to claim 1,wherein said semiconductor element is mounted via an adhesion layer inthe step of mounting said semiconductor element.
 11. The semiconductordevice manufacturing method according to claim 2, wherein saidsemiconductor element is mounted via an adhesion layer in the step ofmounting said semiconductor element.
 12. The semiconductor devicemanufacturing method according to claim 1, wherein a heat sink ismounted on a side that is opposite from the surface provided with saidelectrode terminal of said semiconductor element.
 13. The semiconductordevice manufacturing method according to claim 2, wherein a heat sink ismounted on a side that is opposite from the surface provided with saidelectrode terminal of said semiconductor element.